![datacon 2200 evo datacon 2200 evo](https://img.directindustry.com/pdf/repository_di/13795/datacon-2200-evo-advanced-906342_1m.jpg)
Due to the high flexibility of the multi-chip die bonder, the adhesive tape feeder & cutter can also be integrated at the main axis for single-pass production of thin dies or wet-in-wet stack dies. An optionally available heated bond base and bond head will serve for good process results.
![datacon 2200 evo datacon 2200 evo](https://i.ytimg.com/vi/Qd_pUgmuzgk/maxresdefault.jpg)
The flexibility of the systems permits both high volume production of. Besi Netherlands creates exceptional customer value by offering ultimate reliability and productivity, excellent customer service, extreme precision and high production yields.
Datacon 2200 evo full#
Besides unbeaten flexibility and full customization possibilities, this evolutionary machine offers higher accuracy with long-term stability using a new camera system and thermal compensation algorithm, higher speed through a new image processing unit, and improved cleanroom capabilities. This results in considerable throughput increase! Flip chip is still possible without the need to change any configuration. The Datacon 2200 evo high-accuracy multi-chip die bonder provides the ultimate flexibility for die attach as well as for flip chip applications. The Datacon 2200 evo hS die bonder for Multi Module Attach assembles all kinds of technologies on a tried-and-tested platform, enhanced with key features for higher bonding accuracy and lower cost of ownership. While the ID axis places the film on the substrate, the main axis bonds the die on the prior ready-made bond positions.
![datacon 2200 evo datacon 2200 evo](https://cdn.caeonline.com/images/datacon-besi_2200-evo_1034396.jpg)
To provide even more flexibility, an adhesive tape feeder & cutter can be integrated at the additional dispense axis, offering the parallel processing of film application and die placement in one module. For very high production volumes, several Multi-chip die bonders can be linked up to work in parallel. The tried-and-tested, modular concept has also been retained in the multi-chip die bonder. This significantly increases not only the throughput but also in particular the yield. This enables production, for instance of SiPs (System in a Package), with all kinds of active and passive components in a single pass. Datacon 2200 evo advanced Accuracy & Flexibility for your mass production The new Datacon 2200 evo advanced is the latest edition in the wellestablished and field proven Multi Module Attach platform of Besi. Datacon 2200 evo advanced The new Datacon 2200 evo advanced is the latest edition in the well- established and field proven Multi Module Attach platform of Besi. Further features include the heatable bonding tool, for example for stacked-die applications, and the broad handling range from 250 µm small up to 50 mm large dies. The Datacon 2200 evo hS die bonder for Multi Module Attach assembles all kinds of technologies on a tried-and-tested platform, enhanced with key features for higher bonding accuracy and lower cost of ownership. Of course the multi-chip die bonder is not just intended for die attach, but is also a fully-fledged flip-chip bonder.